| 摘要 |
<p>A heat dissipation member for electronic apparatus composed of a composite material produced by dispersing SiC particles into a matrix metal in which both high thermal conductivity and low thermal expandability can be highly compatible. The heat dissipation member for electronic apparatus is composed of a composite material of rough SiC particles having a large mean particle size, fine SiC particles having a small mean particle size, and a matrix metal principally comprising Al dispersed with the rough SiC particles and the fine SiC particles, wherein the rough SiC particles and the fine SiC particles exist in the matrix metal at a filling rate of 65-75 vol% assuming the entire volume is 100%, the volumetric ratio of the rough SiC particles to the fine SiC particles is 1.5-4, and the mean particle size ratio of the rough SiC particles to the fine SiC particles is 10-15.</p> |
