发明名称 |
Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body |
摘要 |
A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips 2 are intermittently formed on a tape shaped base material 11 in the longitudinal direction of the base material 11 to have a substantially identical shape with that of the semiconductor chip 2 to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions 12 has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips 2 and prevent a wasteful use of an adhesive agent. <IMAGE> |
申请公布号 |
EP1246236(A1) |
申请公布日期 |
2002.10.02 |
申请号 |
EP20020252236 |
申请日期 |
2002.03.27 |
申请人 |
LINTEC CORPORATION |
发明人 |
YAMAZAKI, OSAMU;EBE, KAZUYOSHI |
分类号 |
B65D73/02;B65D85/86;C09J7/02;H01L21/58;H01L21/60;H01L23/10 |
主分类号 |
B65D73/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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