| 摘要 |
The invention provides a resin-sealing apparatus that is operated with a low pressure and with a low clamping force without void generation and that is favorable for shortening the molding time and reduction of sealing resin consumption. In the resin-sealing apparatus of the present invention, a resin injection inlet of a pot has an opening at the center of the cavity surface of a cavity of a bottom mold that is a component of a mold unit, and a plunger for injecting molten resin in the pot from the opposite side to the resin injection inlet side is provided slidably and airtightly with the inside wall of the pot.
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