| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device where a monitor current is not affected by optical output from the rear face of an LD chip. SOLUTION: An LD chip 1 is die-bonded on the vertical face S1 of a stem 3 through a sub-mount 4. A collet 5 is pressed to the LD chip 1 in such a state and light receiving elements 6a and 6b are inserted into the upper part and the lower part of the LD chip 1. Current made to flow to the LD chip 1 through the collet 5 is increased while the intensity of optical output Pf from the front of the LD chip 1 is measured. The intensity of optical output Pr from the rear face when the intensity of the optical output PF from the front becomes an arbitrary value is measured in the light receiving element 6b. An optimum distance from the vertical face S1 of the stem 3 to the end of a PIN chip is decided based on the measured intensity of optical output Pr from the rear face, and the die bonding position of the PIN chip is decided.
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