| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner, together with a manufacturing method of a semiconductor element using it, which manufactures a highly integrated semiconductor element where relative alignment between a mask and a wafer is performed precisely. SOLUTION: The aligner, which exposes a wafer with a mask pattern comprises a position detector which aligns the mask with the wafer by using an alignment mark of a mask and that of a wafer, and a correction means which corrects an error in alignment under skew exposure, based on the offset amount for correcting deviation in rotating at alignment, between the mask and the wafer, which is acquired, based on a deviation from a design value of a wafer alignment mark caused by the exposure skew, when forming alignment mark of a wafer.
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