发明名称 |
Substrate coating unit and substrate coating method |
摘要 |
The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.
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申请公布号 |
US2002134304(A1) |
申请公布日期 |
2002.09.26 |
申请号 |
US20020101707 |
申请日期 |
2002.03.21 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
KOBAYASHI SHINJI;KITANO TAKAHIRO;MORIKAWA MASATERU;TAKESHITA KAZUHIRO;KAWAFUCHI YOSHIYUKI |
分类号 |
H01L21/027;H01L21/00;(IPC1-7):B05C11/02 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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