A liquid curable resin composition comprising an urethane (meth)acrylate which comprises at least one diol component selected from the group consisting of polypropylene glycol with a number average molecular weight of 300-5,000, a copolymer of propylene oxide and ethylene oxide with a number average molecular weight of 300-5,000 and a copolymer of ethylene oxide and butylene oxide with a number average molecular weight of 300-5000. The liquid curable resin composition of the present invention produces a cured product which exhibits improved stability against the influence of heat and moisture and is useful as a secondary material, a ribbon matrix material and an encapsulating matrix material.
