| 摘要 |
PROBLEM TO BE SOLVED: To provide a treatment apparatus capable of making the distribution of the dissolution amount and the etching amount of copper foils in an entire substrate and in the front and rear face seven and suppressing unevenness of the width of a conductor of wiring patterns in the wiring pattern directions by solving the formation of a liquid pool in the center part of the substrate at the time of etching treatment. SOLUTION: Actuators 4, 5 of X- and Y-axis for horizontally shaking upper and lower chemical liquid jetting bodies 2a, 2b and the substrate 1, their transmission means, and a substrate loading and receiving stand 3 are united together and built in a supporting body 7b. The supporting body 7b is slantingly shaken within a range of supporting body slanting angles 7a around a rotary shaft 7c by an actuator 6 for slanting movement. Continuous or intermittent slantingly shaking movement make the treatment of the substrate possible without causing stagnation of the chemical liquid in the center part of the substrate.
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