PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board which can reduce its loop inductance and to provide a manufacturing method for the printed wiring board. SOLUTION: A chip capacitor 20 is arranged in the printed wiring board 10, so the distance between an IC chip 90 and the chip capacitor 20 becomes short and the loop inductance is reduced. The surfaces of metallized electrodes 21 and 22 are coated with conductive paste 26, so the surfaces of the electrodes 21 and 22 can be made flat and the connectivity to a via hole 46 can be increased.