SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package and a manufacturing method therefor, which facilitates and satisfactorily connect outer electrodes to electrode pads made of copper or a copper-containing metal. SOLUTION: The semiconductor package houses a semiconductor element, having one or more outer connecting electrode pads connected to metal bumps formed on a semiconductor component mounting board, the electrode pads are made of copper or a copper-containing metal, and an organic film containing a metal powder is formed on the electrode pads.