发明名称 Method for manufacturing a trench capacitor of a memory cell of a semiconductor memory
摘要 A trench is formed in a substrate with an upper region and a lower region. The trench is subsequently widened in its upper region and in its lower region by isotropic etching. In the upper region, an insulating collar is formed that is designated as a buried insulating collar due to the widened trench. The insulating collar is removed in the vicinity of the surface of the substrate, through which the substrate is exposed in this region. Here, a selective epitaxial layer is subsequently grown in the trench, through which a subsequently formed selection transistor can be formed in perpendicular fashion over the trench, or very close to the trench. In addition, through the widened trench the electrode surface of the capacitor electrodes is enlarged, which ensures an increased storage capacity.
申请公布号 US2002132421(A1) 申请公布日期 2002.09.19
申请号 US20020100812 申请日期 2002.03.19
申请人 SCHREMS MARTIN 发明人 SCHREMS MARTIN
分类号 H01L21/8242;H01L27/108;(IPC1-7):H01L21/824;H01L21/20 主分类号 H01L21/8242
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