发明名称 METAL GATE STACK WITH ETCH STOP LAYER HAVING IMPLANTED METAL SPECIES
摘要 A metal gate structure and method of forming the same introduces metal impurities into a first metal layer, made of TiN, for example. The impurities create a surface region of greater etch selectivity that prevents overetching of the TiN during the etching of an overlying tungsten gate during the formation of the metal gate structure. The prevention of the overetching of the TiN protects the gate oxide from undesirable degradation. The provision of aluminum or tantalum as the metal impurities provides adequate etch stopping capability and does not undesirably affect the work function of the TiN.
申请公布号 US2002132415(A1) 申请公布日期 2002.09.19
申请号 US20010810348 申请日期 2001.03.19
申请人 ADVANCED MICRO DEVICES, INC. 发明人 BESSER PAUL R.;DAKSHINA-MURTHY SRIKANTESWARA
分类号 H01L21/28;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L31/062 主分类号 H01L21/28
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