发明名称 |
FAR INFRARED RAY DRYING DEVICE, DRYING DEVICE CONSITUTING BODY, AND DRYING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the occurrence of breaking of a wire to a fine wiring pattern at a lithography process carried out at an after process for a print substrate by rapidly discharging a solvent in resist ink to the atmosphere from the surface of a print substrate in a state to radiate far infrared rays to resist ink coated on the print substrate. SOLUTION: Far infrared rays of a wave length of approximate 3-approximate 6μm is radiated from a far infrared ray radiation layer, having a metal surface, to the print substrate. A pressure medium is sprayed against the substrate such that the temperature of an object to be dried is reduced to 180 deg.C or less.</p> |
申请公布号 |
JP2002267356(A) |
申请公布日期 |
2002.09.18 |
申请号 |
JP20010116107 |
申请日期 |
2001.03.12 |
申请人 |
DAITO SEIKI CO LTD |
发明人 |
SUZUKI AKIRA |
分类号 |
G03F7/20;F26B3/04;F26B3/30;F26B15/18;F26B21/04;F26B21/10;H05K3/00;H05K3/06;(IPC1-7):F26B3/30 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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