| 摘要 |
<p>A semiconductor system includes a body defining a processing chamber, a holder disposed within the processing chamber to support the substrate, and a fluid injection assembly to facilitate sequential deposition of films. In one embodiment, the fluid injection assembly is coupled to the body and includes high-flow-velocity valves, a baffle plate, and a support. The support is connected between the valves and the baffle plate. In one embodiment the valves are coupled to the support through a W-seal to direct a flow of fluid into the processing chamber, with the flow of fluid having an original direction and a velocity associated therewith. The baffle plate is disposed in the flow path to disperse the flow of fluids in a plane extending transversely to the original direction. In this manner, the baffle plate varies the velocity of the flow of fluids.</p> |
