| 摘要 |
PROBLEM TO BE SOLVED: To provide a partial plating method with high pattern accuracy and simple processes. SOLUTION: The partial plating method for plating a part of a base material is characterized by the first process of forming a self-assembling monomolecular film, by means of supplying a self-assembling compound which can form the self-assembling monomolecular film through adsorbing to the surface of the above base material, onto the surface of the base material, the second process of peeling off a desired part of the self-assembling monomolecular film which has been formed in the above first process, and the third process of electrolytically plating the part at which the self-assembling monomolecular film has been peeled off in the above second process.
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