| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent generation of voids while adequately securing the leveling. SOLUTION: The void-free copper plating method for electrolytically plating copper with the plating liquid which does not contain a surface active agent, after immersing an article to be plated into a pretreatment liquid for the void- free copper plating, which contains at least one leveler consisting of a surface active agent, chloride, a nitrogen based organic compound, and a sulfur compound, comprises dividing the pretreatment liquid into the first pretreatment liquid containing levelers excluding the surface active agent, and the second pretreatment liquid containing the surface active agent, and immersing the article to be plated into the first pretreatment liquid, and then into the second pretreatment liquid. The expected purpose is achieved by pretreating the article in divided 2 stages using the first pretreatment liquid excluding the surface active agent, and the second pretreatment liquid containing the surface active agent, and by pretreating the article in the order of the first pretreatment liquid for the first, and then the second pretreatment liquid.
|
