发明名称 DRAM cell configuration and fabrication method
摘要 The memory cells each have a capacitor and a transistor. A storage node of the capacitor is arranged in a first depression formed in a substrate. A gate electrode of the transistor is arranged in a second depression at a first lateral surface of the second depression. The second depression is spaced apart from the first depression. An upper source/drain region of the transistor adjoins the storage node and the second depression. A lower source/drain region of the transistor is formed deeper in the substrate than the upper source/drain region and it adjoins the second depression.
申请公布号 US6448600(B1) 申请公布日期 2002.09.10
申请号 US20000713484 申请日期 2000.11.15
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHLOESSER TILL;HOFMANN FRANZ;WILLER JOSEF
分类号 H01L27/108;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L27/108
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