| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering material realizing soldering joint for an electronic equipment by the new solder joint, in particular solder joint on the high temperature side in temperature hierarchical joint. SOLUTION: After the solder joint part of a semiconductor device and a board are soldered, a compound 3 containing Sn, etc., is formed around a ball 1 of metals such as Cu, Al, Au and Ag or a metal alloy, the metal ball 1 is connected by the compound 3. The brazing filler metal is provided by the paste containing a mixture of the ball 1 of the metal such as Cu, Al, Au, and Ag or the metal alloy and a metal ball 2 of Sn or In. |
