| 摘要 |
A non-volatile memory device and a fabrication method thereof are provided. A first polysilicon layer, an inter-gate dielectric layer, a second polysilicon layer and a capping layer are stacked sequentially. A first opening is formed through the inter-gate dielectric layer, the second polysilicon layer and the capping layer, thereby exposing the first polysilicon layer. A second opening is formed through the capping layer, thereby exposing the second polysilicon layer. On the resultant structure, a metal layer is formed and then thermally treated. As a result a metal silicide layer can be formed on the exposed portion of the first polysilicon layer and the exposed portion of the second polysilicon layer.
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