发明名称 |
Electrohydrodynamicly enhanced micro cooling system for integrated circuits |
摘要 |
A cooling system employing Micro Electro Mechanical System (MEMS) technology and polarization principles to move a cooling fluid over a surface requiring cooling and further employing electrohydrodynamic principles for the purpose of enhancing the heat transfer coefficient between the cooling fluid and the surface to be cooled.
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申请公布号 |
US6443704(B1) |
申请公布日期 |
2002.09.03 |
申请号 |
US20010798321 |
申请日期 |
2001.03.02 |
申请人 |
DARABI JAFAR;OHADI MICHAEL M. |
发明人 |
DARABI JAFAR;OHADI MICHAEL M. |
分类号 |
F28D15/02;F28F13/16;H02N1/00;(IPC1-7):H02K44/00 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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