发明名称 Electrohydrodynamicly enhanced micro cooling system for integrated circuits
摘要 A cooling system employing Micro Electro Mechanical System (MEMS) technology and polarization principles to move a cooling fluid over a surface requiring cooling and further employing electrohydrodynamic principles for the purpose of enhancing the heat transfer coefficient between the cooling fluid and the surface to be cooled.
申请公布号 US6443704(B1) 申请公布日期 2002.09.03
申请号 US20010798321 申请日期 2001.03.02
申请人 DARABI JAFAR;OHADI MICHAEL M. 发明人 DARABI JAFAR;OHADI MICHAEL M.
分类号 F28D15/02;F28F13/16;H02N1/00;(IPC1-7):H02K44/00 主分类号 F28D15/02
代理机构 代理人
主权项
地址