发明名称 ELECTRONIC COMPONENT SUPPORTING IMPLEMENT AND METHOD FOR SUPPORTING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic component supporting implement, capable of closely fixing a plurality of electronic components to both surfaces of a housing and a radiating plate using one support implement. SOLUTION: The electronic component supporting implement comprises a first elastic fixing part 2 for pressing a first electronic component against a radiating support plate, a second elastic fixing part 2' for pressing a second electronic component to the radiating support plate, a first support plate fixing part 3 fixed to the radiating plate and connected to the first fixing part 2, a second support plate fixing part 3' fixed to the radiate plate and connected to the second fixing part 2', a first hole 6 for the fixing implement formed at the first fixing part 3, a second hole 7 for the fixing implement formed at the second part 3', and a connection part for coupling the first support plate fixing part to the second support plate fixing part.
申请公布号 JP2002246778(A) 申请公布日期 2002.08.30
申请号 JP20010038806 申请日期 2001.02.15
申请人 TDK CORP 发明人 KOBAYASHI MASAYUKI
分类号 H05K7/12;H01L23/40;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/12
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