Via fill compositions for direct attach of devices and methods for applying same

摘要

The present invention permits solder joints (22) to be made directly to via and through holes (14) without the solder being wicked into the vias or through holes (14), by filling plated through holes (14) with a conductive novolac epoxy fill composition (16). When cured and overplated (18), the fill composition (16) provides support for the solder joint and provides a flat solderable surface (18) for the interconnection (22). The invention also relates to several novel methods for filling through holes (14) with such fill compositions (16), and to resistors located in through holes (14) and vias.