| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate suited for the small size and high density use and having superior reliability, by preventing a crack in package for a small semiconductor package and its manufacturing method, and to provide the semiconductor package and its manufacturing method. SOLUTION: The substrate is composed of at least a conductive pattern, connected to a semiconductor chip and an insulating base for supporting the conductive pattern. The substrate for the package has a stopping hole, which does not reach the side of the conductive pattern, on a face opposite to the conductive pattern and at the outer side of an area for mounting the semiconductor chip in the insulating base. |
