| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, in which the density of interconnections is increased, and to provide a method in which the wiring board is manufactured at a low cost and with high efficiency. SOLUTION: In the wiring board, at least two wiring layers are provided, and a pad for mounting a solder ball is formed. In the wiring board, the diameter of the solder ball is 20 to 200μm. In the method of manufacturing the wiring board, a copper layer on one face of a resin film having copper layers on both faces is opened, so as to be aligned with a via hole pattern, the copper layer is used as an etching mask, the resin film is wet-etched to form a via hole, a conductive substance is filled wholly or in part into the via hole, the copper layers on both faces are set to be continuous, the copper layers on both faces are patterned, and the wiring layers and the pad for mounting the solder ball are formed.
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