| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition having excellent high crystallinity, low water absorption, and heat resistance and capable of providing molded articles with high crystallinity, and accordingly suitable as the molding articles for electric/electronic parts, automotive parts, particularly for boards mounted with electronic parts, and its molded articles having low water- absorption property, and excellent heat resistance in a reflow process. SOLUTION: The polyamide resin composition for lead-free soldering is composed of (a) a diamine component comprising (i) 1,9-diaminononane units to be derived from 1,9-diaminononane, aliphatic diamine units other than the 1,9-diaminononane units to be derived from a linear 6-12C aliphatic diamine and/or a 6-12C aliphatic diamine having a side chain and having a content of the 1,9-diaminononane units of 85-100 mol% and (b) a dicarboxylic acid component comprising (ii) 60-100 mol% terephthalic acid units and 0-40 mol% aromatic dicarboxylic acid units other than the terephthalic acid units and/or 0-40 mol% 4-20C aliphatic dicarboxylic acid units.
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