发明名称 STATIC DISSIPATIVE MOLD RELEASE AGENT AND USE IN CASTING AND MOLDING PROCESSES
摘要 A silicone-epoxy resin is mixed with a conductivity enhancing agent, such as carbon black, and is cured to control the resistivity of films that may be used as mold release agents in mold processing or mold shaping electrically sensitive energetic compositions, such as rocket fuels, explosives, gas generator fuels and the like. The uncured precursor to the mold release agent is placed as a coating on molds that are used in these processes. Upon curing on the mold, the enhanced conductivity of the film permits dissipation of static electricity from the electrically sensitive energetic compositions.
申请公布号 WO02064693(A1) 申请公布日期 2002.08.22
申请号 WO2002US03129 申请日期 2002.02.04
申请人 ALLIANT TECHSYSTEMS INC. 发明人 SEIDNER, NATHAN, M.;RACKHAM, JON, L.
分类号 B28B7/36;B29C33/64;C08L83/04;C09D183/04 主分类号 B28B7/36
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