发明名称 Applying structured layer to support substrate involves filling structured pattern substrate with filler, placing pattern on support, binding filler to support, and removing pattern so that filler remains bonded to support
摘要 <p>Applying a structured layer to a support substrate (101) involves filling a structured pattern substrate (102) corresponding to the structured layer with a filler; placing the pattern substrate on the support substrate; bonding so that the filler binds to the substrate; and removing the pattern substrate so that the filler remains bound to the support structure and the structured layer is formed on the support substrate. Preferred Features: The pattern substrate is printed on the support substrate. The pattern substrate is made from a material having a higher melting point than the filler and the material of the support substrate. The pattern substrate is made form silicon dioxide. A pattern substrate release layer is applied to the structured surface of the pattern layer.</p>
申请公布号 DE10104258(A1) 申请公布日期 2002.08.22
申请号 DE2001104258 申请日期 2001.01.31
申请人 INFINEON TECHNOLOGIES AG 发明人 TORMEN, MASSIMO;BORZENKO, TATIANA;SCHMIDT, GEORG;MOLENKAMP, LAURENS
分类号 B81C1/00;(IPC1-7):B81C1/00 主分类号 B81C1/00
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