| 发明名称 |
ADHESIVE COMPOSITION FOR SEMICONDUCTOR DEVICE AND ADHESIVE SHEET |
| 摘要 |
PURPOSE: To obtain an adhesive composition which has excellent heat-resistant temperature cyclicity and excellent humidity resistance and is used for electronic parts, and to prepare an adhesive sheet. CONSTITUTION: The adhesive composition contains (A) an epoxy resin, (B) a phenolic resin, (C) an epoxidized styrene-butadiene-styrene block copolymer, and (D) a diaminosiloxane compound as essential components. |
| 申请公布号 |
KR20020066999(A) |
申请公布日期 |
2002.08.21 |
| 申请号 |
KR20020007497 |
申请日期 |
2002.02.08 |
| 申请人 |
TOMOEGAWA PAPER CO., LTD. |
发明人 |
KOBAYASHI MASAHARU;OKA OSAMU;YOSHII YASUHIRO |
| 分类号 |
C09J9/02;C08G59/50;C08G59/62;C08L53/02;C09J7/02;C09J153/02;C09J161/06;C09J163/00;C09J163/08;C09J183/08;H01L21/52;H01L21/58;H01L23/373 |
主分类号 |
C09J9/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
