发明名称 ULTRASONIC CLEANING METHOD AND EQUIPMENT OF THE SAME
摘要 PROBLEM TO BE SOLVED: To eliminate the drawbacks of the cleaning equipment using a cleaning drum that dirt is restuck to an object to be cleaned as the object to be cleaned is immersed in the cleaning liquid and the problem that the volume of a cleaning liquid 4 increases with cleaning equipment using a nozzle 1. SOLUTION: The under surface of a supporting member 6 of an ultrasonic wave generation section is fitted with a vibration member 7 and an ultrasonic vibrator transducer 8 is adhered onto this vibration member 7. The ultrasonic vibrator transducer 8 is electrically connected by an electrode lead wire 9 to a connector 10 attached to the upper part of the supporting member 6 of the ultrasonic wave generation section. Oscillation output from an ultrasonic oscillator 12 is supplied across a cable 11 to this connector 10 and further the object 13 to be cleaned, such as a semiconductor wafer, is held apart a slight spacing so as to face the vibration member 7 in the lower part of the supporting member 6 of the ultrasonic wave generation section. Both sides of the supporting member 6 of the ultrasonic wave generation section are fitted with nozzles 15 for supplying the cleaning liquid from a cleaning liquid feeder 14.
申请公布号 JP2002233837(A) 申请公布日期 2002.08.20
申请号 JP20010029177 申请日期 2001.02.06
申请人 HONDA ELECTRONIC CO LTD 发明人 MIYAMOTO TOSHIAKI
分类号 B08B3/12;B06B1/06;B06B3/04;H01L21/304;(IPC1-7):B08B3/12 主分类号 B08B3/12
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