| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board where a land at the soldering surface side of a through-hole is squared for high-density packaging and wiring, when inserting and soldering the component lead of lead frame components, and to provide a technology regarding the manufacturing method of the printed- wiring board. SOLUTION: As shown in Figure 1, the printed-wiring board related to the aspect comprises the through-hole 1 for fitting the lead frame components on a printed-wiring board surface 7 and a pattern 5, and the through-hole 1 has a land 2 in a square shape 4 at the side of a soldering surface.
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