发明名称 INSTRUMENT PANEL MODULE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an instrument panel module capable of being inexpensively manufactured, and its wiring structure. SOLUTION: The instrument panel module 1 comprises various mounted equipment and device units mounted in a casing portion 15 and a wiring member 20 having a wiring circuit 14 for electrically connecting the mounted equipment and the device units. Since the wiring circuit 14 is patterned directly on the casing portion 15 by pressing, the instrument panel module 1 can be inexpensively manufactured.
申请公布号 JP2002225643(A) 申请公布日期 2002.08.14
申请号 JP20010024912 申请日期 2001.01.31
申请人 FUJIKURA LTD 发明人 TERUNUMA ICHIRO;AKASHI KAZUYA;IDE TAKEHISA;OBA KIYOTSUGU
分类号 B60R16/02;B60K37/00;H05K3/20;(IPC1-7):B60R16/02 主分类号 B60R16/02
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