| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which gives cured items excellent in the resistance to soldering heat, electroless plating property and insulation, can be developed with an organic solvent or a dilute alkali solution, and is suitable for a solder resist and an interlaminar insulating layer. SOLUTION: The composition contains (A) a resin obtained by reacting an epoxy (meth)acrylate resin, which is a reactant of (a) an epoxy resin represented by the formula (I) [n is 1-5], (b) a compound having each one of ethylenically unsaturated group and carboxyl group in a molecule and, if necessary, (c) a saturated monocarboxylic acid, if necessary, with (d) a polybasic acid anhydride and (B) a diluent. |
