| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder plating chips from clogging the gap between a work receiving die and a cutting punch to avoid depositing the solder plating chips to leads, thereby prolonging the life of the die. SOLUTION: A semiconductor chip is sealed in a lead frame to form a semiconductor package, the lead frame is solder-plated, unwanted portions such as resin burrs and die bars, etc., are cut off, and the top ends of leads are cut in line by a lead cutting die after forming the leads. The die comprises a work receiving die 4 for mounting the semiconductor package 1, a lead retainer 3 for pressing and securing leads 2 of the semiconductor package 1, and a cutting punch 5 movable up and down with a specified gap 8 defined by the vertical side of the die 4 and the punch for cutting lead top ends 2a projecting from a lead retaining face of the die 4. The vertical side of the die 4 for forming the gap 8 has a groove 6 for taking solder plating chips 7 into the gap 8 during cutting the leads.
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