| 摘要 |
PURPOSE:To improve the degree of vacuum of the cavity part of the title semiconductor device molding equipment by a method wherein a chamber having a seal in provided at a part of the top force or the bottom force. CONSTITUTION:When a frame 17, on which a semiconductor element is mounted, is charged in the bottom force 20 and it is clamped, the external surface 24 of the top force 21 is intruded into the internal surface 23 of the chamber 22 located in the bottom force 20, the formed part of the top and the bottom forces is brought into a harmetically sealed state with the gap (a) opened. The top and the bottom forces are evacuated in the above-mentioned state, and after the degree of vacuum has been confirmed, they are clamped. According to this constitution, as a vacuum attraction is obtained by having sufficient gap (a), a molding operation can be performed in a high degree of vacuum atmosphere. Besides, the chamber 22 may be provided in the upper force 21. t. |
