发明名称 |
Integrated circuit with improved interconnect structure and process for making same |
摘要 |
A semiconductor die and an associated low resistance interconnect located primarily on the bottom surface of such die is disclosed. This arrangement provides a flexible packaging structure permitting easy interconnect with other integrated circuits; in this manner, a number of such circuits can be stacked to create high circuit density multi-chip modules. A process for making the device is further disclosed. To preserve structural integrity of a wafer containing such die during manufacturing, a through-hole via formed as part of the interconnect is filled with an inert material during operations associated with subsequent active device formation on such die. |
申请公布号 |
US6429509(B1) |
申请公布日期 |
2002.08.06 |
申请号 |
US19990304244 |
申请日期 |
1999.05.03 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
HSUAN MIN-CHIH JOHN |
分类号 |
H01L23/48;H01L25/065;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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