发明名称 PROCEDE DE REALISATION DE DISPOSITIFS COMPRENANT UNE PUCE ASSOCIEE A UN ELEMENT DE CIRCUIT ET DISPOSITIFS OBTENUS
摘要 <p>The invention concerns a method for making electronic devices, each comprising at least a chip (2) electrically connected to at least a circuit element (20), the chip being in the form of a very thin layer associated with a protective substrate (4). The invention is characterised in that it consists in producing at least part of the circuit element (20) on the protective substrate (4), the latter integrally forming part of the device produced. The chip (2) can be produced according to the silicon on insulator technology. The circuit element produced on the protective substrate can be an antenna (20) designed to form a communication interface with the or each chip (2) whereto it is connected. The invention also concerns the use of said method for producing means for identifying and/or tracking an object (30), the use of a protective substrate to produce at least part of at least a circuit element and a device using such a substrate.</p>
申请公布号 FR2795235(B1) 申请公布日期 2002.08.02
申请号 FR19990007555 申请日期 1999.06.15
申请人 GEMPLUS 发明人 PATRICE PHILIPPE;FIDALGO JEAN CHRISTOPHE;CALVAS BERNARD
分类号 G06K19/077;H01L23/498;H01L23/522;(IPC1-7):H01L21/84;H01L23/50;H01L23/32 主分类号 G06K19/077
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