| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is free from reflow crack, even when an organic substrate is used, by improving the peel strength of a resin paste composition to a support member, especially the peel strength to the organic substrate, and by lowering the stress of the resin paste composition to control the occurrence of chip cracks and chip curvature. SOLUTION: This resin paste composition is prepared by homogeneously dispersing (A) butadiene oligomer, (B) an acrylate or a methacrylate, (C) a radical initiator, and (D) a filler.
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