Interconnection system with lateral barrier layer

摘要

An interconnection system having a bottom metal layer that has a conduction layer with a sidewall and an overlying barrier layer. A lateral barrier layer is disposed adjacent the sidewall of the conduction layer, and an insulation layer is over the bottom metal layer. The insulation layer forms vias extending through the insulation layer to the bottom metal layer. A top metal layer extends through the vias to electrically contact the bottom metal layer. The overlying barrier layer and the lateral barrier layer are relatively resistant to interaction with the top metal layer as compared to the conduction layer.