发明名称 |
Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
摘要 |
A wafer cap protects micro electromechanical system ("MEMS") structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.
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申请公布号 |
US2002096743(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US20010006964 |
申请日期 |
2001.12.05 |
申请人 |
SPOONER TIMOTHY R.;HARNEY KIERAN P.;COURAGE DAVID S.;MARTIN JOHN R. |
发明人 |
SPOONER TIMOTHY R.;HARNEY KIERAN P.;COURAGE DAVID S.;MARTIN JOHN R. |
分类号 |
B81B7/00;B81C1/00;H01L21/68;(IPC1-7):H01L21/44;H01L23/544;H01L21/30 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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