发明名称 HEATING TREATMENT DEVICE AND HEATING TREATMENT METHOD
摘要 PURPOSE: To prevent the oxidization of copper, printed as a wiring, upon heating a print substrate made of ceramic. CONSTITUTION: A hot plate 4 is constituted of a plurality of divided bodies 4a, 4b, 4c and a plurality of passages 8 are bored horizontally on the divided body 4a while vertical passages 9 are bored on the divided bodies 4b, 4c and the upper ands of the passages 9 are communicating with the passages 8. Further, inert gas supplying pipes 10 are inserted into the passages 9 from the lower part thereof and inert gas injection ports, connected to the passage 8, are opened on the upper surface of the hot plate 4.
申请公布号 JPH08327254(A) 申请公布日期 1996.12.13
申请号 JP19950135085 申请日期 1995.06.01
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SAGO HIROHITO;MIZUKI HIDEYUKI;OKANO SUSUMU;MIYAMOTO HIDENORI
分类号 F27D5/00;H05K1/09;H05K3/12;H05K3/46;(IPC1-7):F27D5/00 主分类号 F27D5/00
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