| 摘要 |
PROBLEM TO BE SOLVED: To provide an equipment in which heat distribution within a main body being exposed to a thermal load, does not have a risk of thermal deformation and, does not deteriorate an effect of low coefficient of thermal expansion, in a temperature compensator for the main body which is exposed to the thermal load and manufactured of a material with a specific low thermal conductivity. SOLUTION: A heat distribution device having more than one heat distribution body is connected with a surface of the main body which is exposed to the thermal load in such a manner as a gap 18 exists between the main body 1 and the heat distribution body 11. The gap, in connection with a mechanical separation, is filled with fluid 17 for the purpose of thermal combination between the main body and the heat distribution. |
