WAFER ABSORBING UNIT AND METHOD FOR FABRICATING PASSIVATION LAYER ON WAFER BY USING THE SAME

摘要

PURPOSE: A wafer absorbing unit is provided to form a thin deposition layer and to reduce passivation metal consumed by grinding, by making a wafer in direct contact with the passivation metal so that the layer is deposited through a preheating treatment process. CONSTITUTION: A position disc positions uniformly the wafer(11). A supporting unit fixes the position disc. A fixing ring for preventing the wafer moving is installed on the position disc. A preheating wire is disposed in the inner and outer circumference of the fixed ring. A temperature measuring unit controls the temperature of the preheating wire. A cross-type absorbing hole vacuum-absorbs the wafer and fixes the wafer inside the fixed ring.