发明名称 SOLDERING METHOD, ITS APPARATUS, AND MANUFACTURING SYSTEM HAVING THE APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a soldering method, its apparatus, and a manufacturing system capable of effectively soldering a plurality of a soldered portion in a board and also soldering in high quality and in low cost without any interference between the soldered portion and components. SOLUTION: In a soldering robot soldering a soldered portion adjacent to a solder feeding face by heating an iron tip 31 of an iron member 32 and also supplying solder to the solder feeding face of the iron tip 31, the solder feeding faces 310A and 310B as the iron tip are formed on each of two exposed side faces extending along a relatively moving direction of the iron tip to the board, and string-like solder 40 is supplied to each of the solder feeding faces of the iron tip from needle members 35A and 35B of solder supplying heads 34A and 34B, respectively. It is also suitable that solder 40 can be selectively supplied to each of the solder feeding faces based on information of the soldered portions.
申请公布号 JP2002192341(A) 申请公布日期 2002.07.10
申请号 JP20010332357 申请日期 2001.10.30
申请人 RICOH MICROELECTRONICS CO LTD 发明人 UCHIDA TAKAO;INAMURA HIROSHI
分类号 B23K3/06;B23K3/00;B23K3/02;(IPC1-7):B23K3/06 主分类号 B23K3/06
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