发明名称 |
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature |
摘要 |
A method and associated apparatus of electroplating an object and filling small features. The method comprises immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features. In one embodiment, the mechanical enhancement comprises mechanically vibrating the plating surface. In another embodiment, the mechanical enhancement comprises mechanically vibrating the electrolyte solution. In a further embodiment, the mechanical enhancement comprises increasing the pressure applied to the electrolyte solution.
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申请公布号 |
US2002084189(A1) |
申请公布日期 |
2002.07.04 |
申请号 |
US20010754499 |
申请日期 |
2001.01.03 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
WANG HOUGONG;ZHENG BO;DIXIT GIRISH;CHEN FUSEN |
分类号 |
C25D5/00;C25D7/12;C25D21/10;(IPC1-7):C25D21/06;C25D21/16;C25D17/00 |
主分类号 |
C25D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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