| 摘要 |
A device for connecting a high-density multi-conductor line to an element having electrically conducting portions. Each signal conductor of the line is electrically connected to a conducting segment of an inter-connecting wafer formed of conducting material, the segments being electrically isolated from each other and from the conducting material of the wafer by dielectric material. The other end of each segment passes through the wafer and contacts a malleable portion secured to a conducting island of an electrically conducting connecting wafer. The islands are electrically isolated from the conducting material of the wafer and from each other by dielectric material. The wafers are secured together and mounted in a housing which preferably also contains a pressure pad. For preferred embodiments, the ground conductor of the line is secured to the conducting material of the inter-connecting wafer with malleable portions being secured to the conductive material of the connecting wafer to carry the ground level to this wafer. Malleable portions are also provided on the underside of each island and on the underside of the conducting material of the connecting wafer. The conducting portions of the element are brought into contact under pressure with these portions to complete a connection. |
