| 摘要 |
<p>The present disclosure relates generally to resin formulations for sheet molding compounds. Particularly, but not by way of limitation, the disclosure relates to low-density thermosetting sheet molding compounds (SMC) comprising a treated inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low- density filler, and substantially the absence of calcium carbonate. The thermosetting SMC are used to prepare exterior and structural thermoset articles, e.g. auto parts and panels, etc that have Class A Surface Quality.</p> |
