发明名称 |
Semiconductor device with metal silicide film on partial area of substrate surface and its manufacture method |
摘要 |
First and second regions are defined in a principal surface of a semiconductor substrate. Two projected structures are disposed on the principal surface of the first region and spaced apart by a certain distance. The two projected structures run on a first active region in the first region and on an element isolation region around the first active region. A first silicide film is formed on the surface of a partial active region in the principal surface in the second region. A burying member covers the side walls of the two projected structures and buries a space between the two projected structures at least in the element isolation region. The burying member is not formed above the two projected structures. A metal silicide film is not formed on the surface of the first active region.
|
申请公布号 |
US6414375(B1) |
申请公布日期 |
2002.07.02 |
申请号 |
US19990236091 |
申请日期 |
1999.01.25 |
申请人 |
FUJITSU LIMITED |
发明人 |
OHKAWA NARUMI |
分类号 |
H01L21/822;H01L21/60;H01L21/768;H01L21/8234;H01L21/8242;H01L27/04;H01L27/088;H01L27/108;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/822 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|