发明名称 SEMICONDUCTOR LASER MODULE WITH THERMION COOLING ELEMENT
摘要 PROBLEM TO BE SOLVED: To obtain an inexpensive semiconductor laser module with thermion cooling element, in which variation in the output from an optical fiber can be reduced by about 50%. SOLUTION: A lens 4 integrated with an optical isolator 3 is inserted into a holder 9 secured, by Ag brazing, to the wall of a package 8 having a flange 7 being fixed to an external heat dissipation fin on the bottom plate and secured in place by means of solder while being sealed hermetically. On the inside of a package 8, a heat sink 10 formed of a copper tungsten alloy and having a size of 5.5×6.5×6.5 mm is secured, by Ag brazing, to the inner wall face 11 and the bottom face 12 on the side opposite to the holder 9.
申请公布号 JP2002185070(A) 申请公布日期 2002.06.28
申请号 JP20010301511 申请日期 2001.09.28
申请人 OPNEXT JAPAN INC 发明人 TANAKA TSUYOSHI;AOKI SATOSHI
分类号 G02B6/42;H01L23/34;H01L23/373;H01L23/38;H01L35/28;H01L35/30;H01S5/022;H01S5/024;(IPC1-7):H01S5/022 主分类号 G02B6/42
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