| 摘要 |
PROBLEM TO BE SOLVED: To obtain both an adhesive composition having high adhesion to a substrate and capable of exhibiting good patterning performances without problems such as deposition and a heat-resistant photosensitive resin composition using the adhesive. SOLUTION: The alkoxysilane compound is represented by formula (1) (wherein, R1, R2, R'1 and R'2 are each a 1-10C alkyl group; (m) is an integer of 0-2; R3 and R'3 are each a bivalent organic group; and R4 is a bivalent organic group containing an aromatic group). |
