| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin laminate, in which the buried slit depth of relief is decreased and the thin line width is not more increased than that of a negative film. SOLUTION: In the photosensitive resin laminate formed by providing at least a substrate, a photosensitive resin layer, a slip coat layer and a cover layer, the cover layer is a mat cover film having surface roughness (Ra) of 0.20-0.50 in the side facing the slip coat layer and the photosensitive resin layer has a multilayer structure compound of at least two layers. |
